Germany’s Minister of Transport Dobrindt learns about the future of the car
Munich, Germany – January 18, 2016 – The German Federal Minister of Transport and Digital Infrastructure Alexander Dobrindt acknowledges the ...
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Tag: Semiconductor & IC
Power Integrations’ InnoSwitch-CP ICs Dramatically Improve Charging Performance of Smart Mobile Devices
Constant power profile pairs with Qualcomm Quick Charge, USB-PD and other adaptive-voltage protocols Shenzhen, China – January 14, 2016 – ...
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Integration of Isolation for Grid-Tied Photovoltaic Inverters
The photovoltaic (PV) industry has been enjoying great growth over the past few years, mostly driven by high oil prices ...
Read moreIESA Applauds ‘Startup India’ Initiative
Believes entrepreneurship will be key in transforming “Make in India” in ESDM into a success January 15, 2016; Bangalore: India ...
Read moreVishay Intertechnology VRPower® Integrated DrMOS Power Stages Deliver High Power Density and Efficiency for Notebooks, Ultrabooks, and Desktops
Optimized for Mobile Computing Platforms, Space-Saving Devices Offer Continuous Current of 30 A and 40 A in 4.5 mm by ...
Read moreSTMicroelectronics Introduces World’s First 4-Ball WLCSP EEPROM with Multiple I2C Addresses
New Delhi, January 13, 2016 - STMicroelectronics has extended its M24 serial EEPROM family with four new devices that are ...
Read moreInfineon OPTIGA™ TPM chips protect latest Microsoft Surface devices
Munich, Germany – January 13, 2016 – Microsoft puts emphasis on hardware based security to protect sensitive user data stored ...
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