PiBond pioneers a new material approach for MEMS and 3D IC manufacturing
Pibond is awarded patent for its SAP technology platform. © Pibond PiBond today announced the latest ...
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Tag: Semiconductor & IC
First MediaTek-Powered Smartphone Launched by Verizon Wireless
New LG smartphone with MediaTek’s premium Helio P10 chipset debuts on Verizon network BANGALORE, India – October 20, 2016 – ...
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Mouser Electronics Showcases Newest Technologies at ARM TechCon 2016
October 19, 2016 – Mouser Electronics, Inc., the industry’s leading New Product Introduction (NPI) distributor with the widest selection of ...
Read moreFujitsu Laboratories Develops New Architecture that Rivals Quantum Computers in Utility
KAWASAKI, Japan, Oct 20, 2016 - Fujitsu Laboratories Ltd. today announced that it has collaborated with the University of Toronto ...
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Analog Devices’ Low Power AFE Enables Smaller, Lighter Wearable Health Devices with Longer Battery Life
Bangalore, 20th October 2016—Analog Devices, Inc. today announced a low power, next-generation biopotential analog front end (AFE) which enables smaller, ...
Read moreInfineon and Argus enhance the security of the connected and automated car and present a cyber security solution for central gateway protection
Munich and Baden-Baden, Germany and Tel-Aviv, Israel – October 19, 2016 – Real-time cyber security is key for the connected ...
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Renesas Electronics Introduces Two Versions of Third-Generation R-Car Starter Kits
Accessible Development Kits for Highly-Specialized Software Engineers Working with Image Recognition and HMI Technologies Renesas R-Car ...
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