Xilinx Doubles Industry’s Highest Capacity Device to 4.4M Logic Cells, Delivering Density Advantage that is a Full Generation Ahead
Virtex UltraScale extends device density lead from 2x at 28nm to 4x at 20nm, using advanced 3D IC technology to...
Virtex UltraScale extends device density lead from 2x at 28nm to 4x at 20nm, using advanced 3D IC technology to...
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