HGI Moves a Step Closer to Making Interoperable Smart Home a Reality
Standards organisation publishes software modularity requirements for smart home HGI Open Platform 2.0 15 May 2014. HGI, a leading organisation...
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ThinPAK 5×6 Brings Smallest CoolMOS™ MOSFETsEver into Adapters, ConsumerElectronics and Lighting Applications
Neubiberg, Germany –May 15, 2014– Infineon Technologies introducesa new leadless surface mounted(SMD) package for CoolMOS™ MOSFETs named ThinPAK 5x6. Chargers...
Telit M2M Technology to Help Turtles and Tourism on North Carolina Coast
The Telit HE910 module will communicate nest temperature and movement data to more accurately predict hatching of threatened and endangered...
TI’s C2000™ Solar Micro Inverter Development Kit provides complete hardware and software for high-performance solar power systems
Based on real-time control C2000 Piccolo™ F28035 microcontroller (MCU), new kit completes TI's full suite of solar solutions for a...
Indium Corporation VP of Technology to Present at ECTC
Indium Corporation's Dr. Ning-Cheng Lee, vice president of technology, will teach a professional development course at the Electronic Components and...
Indium Corporation Technology Expert to Present at Brasage
Indium Corporation’s Graham Wilson, applications engineer, will present at Brasage in Brest, France on Friday, May 23. Wilson’s presentation, Elimination...
HiSilicon Expands Cadence Palladium XP Platform Usage For Mobile and Digital Media SoC and ASIC Development
SAN JOSE, Calif., May 12, 2014—Cadence Design Systems, Inc. , a leader in global electronic design innovation, announced that HiSilicon...
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