How to Design With USB for the Android Platform – Book by Cypress Employee
"Unboxing Android USB" Provides Real-World Examples With Various USB Device Classes Using Multiple Cypress Products, Including EZ-USB(R) FX3(TM), USB-Serial and...
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SIPLACE Placement Technology Showcased at JISSO Protec 2014 Japan
At the JISSO Protec 2014 show being held at Tokyo’s Big Sight Exhibition Center June 4-6 2014, ASM Assembly Systems...
Infineon TLE4966V Hall Sensor reduces cost and lowers test and manufacturing time by up to 50 percent
Neubiberg and Nuremberg, Germany – June 4, 2014 – In the future, power window lift and power trunk lift system...
Agilent Solutions used at NBTI Research at IIT-Bombay to make Ultrafast Measurement
New Delhi June 5, 2014 – Agilent Technologies Inc. (NYSE: A) today announced that the Agilent B1530 Waveform Generator/Fast Measurement Unit...
First fabless company to produce automotive microcontroller using GLOBALFOUNDRIES 55nm manufacturing platform
Scaleo chip today announced that they are the first fabless company to introduce an automotive microcontroller manufactured with the new...
Nanofics Technology Spreads Quickly Among Electronic Device Manufacturers
Belgium based Europlasma NV, a world leader in the design and manufacturing of low pressure plasma equipment since 1993 is...
MEMS: A look at its evolution and potential it offers in the connected world
From mobile phones to computing devices, MEMS have now entered inside computing devices capable of sensing them when they are...
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