Rohm New Low Ohmic Chip Resistors for Current Detection
Contributes to greater miniaturization and energy savings in smartphones and wearable devices ROHM has recently announced the development of low-ohmic...
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PARMI Announces New SPI Defect Repair Feature for SIGMA X
New “Jet” module increases SPI throughput and ROI MARLBORO, MA–August2014– PARMI, a leader in 3-D solder paste inspection (SPI) of...
FCT Assembly to Exhibit Solution-Driven Solder Pastes at the SMTA Capital Expo
GREELEY, CO — FCT Assembly today announced plans to exhibit at the SMTA Capital Expo & Tech Forum, scheduled to...
Allegro New Galvanically Isolated Current Sensor IC
Designed with Differential Output and Externally Adjustable Gain Worcester, MA – August 28, 2014 - Allegro MicroSystems, LLC introduces a new...
Melexis Launches Automotive Ready Wireless Charging & NFC Reference Design with Freescale
Tessenderlo, Belgium, 27th August 2014 – Wireless charging promises consumers a new level of convenience for maintaining readiness of mission critical and...
Model-Based Design have proven to be ideal in addressing the challenge of efficient design and verification of analog and mixed-signal systems.
Dr. Arun Mulpur, Industry Group Manager MathWorks Integrating analog and digital signals pose a number of...
CyberOptics to Debut Its Conformal Coating Inspection Solution at SMTA International
CyberOptics Corporation announces that it will launch its CX150i™Conformal Coating Inspectionsystem in Booth #218 at SMTA International, scheduled to take...
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