10 Years of SIPLACE Centre Asia (SCA): Looking back at Challenges, Opportunities and Growth
Mr. Low Wei Hsien, Vice President of the SCA Established in 2004 in Singapore, the SIPLACE...
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TSMC Certifies ANSYS Power Integrity, Electromigration and Thermal Reliability Solutions for TSMC 16nm FINFET+ Technology
TSMC and ANSYS collaborate on early enablement for 10nm FinFET process Pittsburgh – September 29, 2014 – ANSYS announced that...
TSMC and Synopsys Accelerate Custom Design Productivity for 16FF+Process
Collaboration Enables Best Practices for Custom Implementation Productivity with FinFET Devices Bangalore, Sept 30, 2014 Highlights: Synopsys custom design solution...
New LED lighting profiles using SABIC’s LEXAN™ resins is first to comply with pan-European railway fire safety standard
Railway coach manufacturers can now employ high-performance LED (light-emitting diode) lighting systems, including profiles that adhere to the sweeping new...
Dassault Systèmes encourages ‘PLM as a Service’ adoption for Indian Businesses
3DEXPERIENCEForum, 2014 successfully concluded in India New Delhi, September 30, 2014 - Dassault Systèmes (Euronext Paris: #13065, DSY.PA), the 3DEXPERIENCE Company, world...
Deloitte ranks eInfochips among the fastest growing technology companies
Infochips on the Deloitte Technology Fast500 Asia Rankings Ahmedabad 30 Sep 2014: eInfochips, a leading Product Engineering Services Company has...
ZTE customer E-Plus ranked second in mobile network test
ZTE helps E-Plus to modernise its UMTS network and deliver LTE equipment 30 September 2014- ZTE Deutschland GmbH, a subsidiary ...
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