Infineon Expands its Trusted Computing Expertise to Mobile Devices
OPTIGA™ TPM 2.0 Chips Secure Microsoft Surface Pro 3 Tablet Munich, Germany – February 6, 2015 – Infineon Technologies AG ...
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Littelfuse Introduces Low Capacitance ESD Protection TVS Diode Arrays Optimized for Fast-Charging Peripherals
0.3Ω dynamic resistance provides clamping voltages more than 23 percent lower than similar silicon solutions China, Beijing, February 10, 2015 — Littelfuse,...
ViewSonic Smarter LightStream™ Projector Line
The LightStream PJD5 Value Series of Projectors Deliver Advanced Features in a Sleek, Streamlined Design New Delhi – February 10,...
Android is the most vulnerable mobile Operating System
Popular apps like Dropbox, Snapchat &, Uber have faced cyber-attacks in the past New Delhi, February 9, 2015: - Along...
IESA Vision Summit 2015
Greater role for Indian Electronics & Semiconductor Industry in Indian space programs: Dr. K. Radhakrishnan, former chairman, ISRO IESA...
MegaChips Utilizes Cadence Tensilica Xtensa Processor in Ultra-Low Power Internet of Things Sensor Hub IC
Xtensa Processor Selected After Competitive Benchmark Shows 90 Percent Lower Power Consumption for Arithmetic Operations SAN JOSE, Calif., February 9,...
TI to drive innovation for IoT, industrial and automotive applications at embedded world 2015
Bangalore, 9th February 2015 — At embedded world in Nuremberg, Germany, Texas Instruments (TI) will demonstrate how its embedded processing and...
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