Industry’s Smallest IO-Link® Transceiver Reduces Power Dissipation More Than 50%
Maxim Integrated’s MAX14827 enables intelligent sensors with reduced maintenance and increased uptime with continuous diagnostics and monitoring. Munich, Germany —...
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Hammond adds new dedicated Arduino and BeagleBone development board enclosures
Released February 22, 2016 Hammond Manufacturing has further extended its family of design-specific plastic enclosures for housing small form factor development...
Digi International Announces Thread-Ready XBee Module
New XBee Module Illustrates Application of Thread Protocol in Industrial Applications and Company's Role in Creating New, Advanced Wireless Solutions...
Bluetooth low energy 4.2 module brings state-of-the-art performance and power efficiency to IoT designs
Sensing and control applications can be embedded on top of the NINA-B1 module stack Thalwil, Switzerland - February 22, 2016...
Infineon and GoerTek optical sensor solutions deliver precise, ultra-lowpower heart rate monitoring forsmart devices
Munich, Germany – February 19, 2016 – Infineon Technologies AG and GoerTek Inc. launched two high-resolution, highly integrated optical sensors....
High-performance Atmel SAMA5D2 Xplained Ultra from element14 for fast prototyping and evaluation
High-performance, ultra low-power ARM MPU kit extends Atmel Xplained concept for industrial, IoT, LED and decorative lighting applications BANGALORE -...
NEC Develops Massive-element Antenna for 5G Base Stations
TOKYO, Feb 22, 2016 - NEC Corporation announced it has developed a prototype of A4-sized massive-element Active Antenna System (AAS)...
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