UMC Qualifies Cadence Virtuoso LDE Analyzer for its 28HPCU Process
Highlights: Cadence solution enables UMC customers to mitigate layout-dependent effects in custom/analog designs Customers using the new UMC 28HPCU LDE...
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TECAT Announces First Wireless Torque Sensor Model Featuring Shunt Calibration
ANN ARBOR, Mich. — April 13, 2016 — TECAT Performance Systems today announced the release of the WISER 2030-S, the...
Telit acquires IP and Cellular Module Products from Novatel Wireless
New Delhi, April 13, 2016 – Telit Communications PLC, (AIM: TCM, “Telit”, the “Group”), a global enabler of the Internet...
Cobham Introduces New 8800SX Digital Land Mobile Radio Test Set
LAS VEGAS, Nevada - Cobham has introduced the new 8800SX Digital Radio Test Set for testing Land Mobile Radio systems....
Ansys Solutions Qualify for The Latest Generation Of Samsung Foundry Chip Technologies
Qualification of 14nm and 10nm FinFET technology platforms enables users to create robust and reliable integrated circuits for a variety...
Texas Instruments India Hosts Worldwide “DIY with TI” Program in Bangalore
Event celebrates DIYers and recognizes the best Do-It-Yourself projects created by TI Engineers Bangalore, 13th April 2016 -- Texas Instruments (TI)...
Renesas Electronics Announces Industry-First Power Supply IC Supporting the Power Rules Requirements in USB Power Delivery V. 2.0 and 3.0 Specifications
Renesas High-Efficiency Power Supply IC for USB PD 2.0 and 3.0: RAA230161 RAA230161 Achieves Multi-Voltage Outputs...
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