Panasonic introduces Soft-PGS, a thermal management solution for extremely thin spaces
200µm thickness guarantees thermal stability up to 400°C with thermal conductivity up to 400W/mK Munich, December 2016: Panasonic Automotive &...
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IR HiRel offers enhanced radiation hardened MOSFET family for mission-critical applications in space
Munich, Germany, and El Segundo, USA – December 21, 2016 – IR HiRel, an Infineon Technologies AG (FSE: IFX /...
Taiwan’s Largest I-kuan Tao Temple Embraces Green Energy with GlacialLight
December 20, 2016 - Taipei Taiwan - Taiwan is a multi-religious society – I-Kuan Tao originated from China and has since...
Hakuto of Japan to Hitch a Ride to the Moon Aboard Teamindus Spacecraft
TeamIndus sign agreement with Team HAKUTO to carry robotic rover to the Moon Bangalore, India, December 21, 2016: TeamIndus is happy...
MSEDCL and BYPL partners with Sensus, a Xylem brand, to implement Advanced Metering Infrastructure solution in Maharashtra
New Delhi, December 20, 2016: Maharashtra State Electricity Distribution Co. Ltd. (MSEDCL) and BSES Yamuna Power Ltd (BYPL) has signed...
Samtec to Present Flyover QSFP28 Technical Paper and PCIe®-Over-FireFly™ Product Demonstration at DesignCon 2017
New Albany, IN: Samtec, a privately held $625MM global manufacturer of a broad line of electronic interconnect solutions, will participate...
GL Announces SGs Protocol Emulator for Circuit Switched Fall Back in LTE Networks
Gaithersburg, Maryland, USA – December 20, 2016 - GL Communications Inc., announced today its latest product MAPS™ SGs Protocol Emulator with support...
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