VIAVI Unveils Advances in 6G and AI Research
Bangalore - April 05, 2024 -- Viavi Solutions today shared milestones in 6G and AI research based on the company's...
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MathWorks Announces Release 2024a of MATLAB and Simulink
Updated Satellite Communications Toolbox Models Scenarios and Analyzes Communications Systems and Links NATICK, Mass. – April 5, 2024 – MathWorks...
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Murata demonstrates its connectivity and mobility capabilities at Embedded World
Hoofddorp, Netherlands: Murata will showcase a wide range of innovative connectivity and mobility at Embedded World (Nuremberg, 9th-11th April). Amongst...
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STMicroelectronics’ NFC reader brings outstanding performance-to-cost ratio of embedded contactless interaction to high-volume consumer and industrial devices
STMicroelectronics’ ST25R100 near-field communication (NFC) reader delivers a unique combination of advanced features, robust communication, and affordability, raising the value...
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DigiKey and NXP Unveil MCX MCU Design Contest at Embedded World 2024
Nuremberg, Germany - DigiKey, a leading global commerce distributor offering the largest selection of technical components and automation products in...
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Infineon becomes World market leader in automotive MCUs for the first time
Peter Schiefer, President of the Automotive Division at Infineon Munich, Germany – 9 April 2024 – Infineon Technologies AG (FSE:...
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DAMC-3H3P-J-K87 D-Sub Connector: Paving the Way for Reliable Data Transmission
Pave the way for reliable data transmission with the DAMC-3H3P-J-K87 D-Sub Connector. Boost your connectivity standards and embrace a future...
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