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Infineon extends radiation-hardened memory portfolio with industry’s first space qualified parallel interface 1 and 2 Mb F-RAMs
Munich, Germany – 18 June 2024 – Space-based applications are an important area for Infineon Technologies AG (FSE: IFX /...
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The Future of Electric Vehicles
The future of electric vehicles looks bright thanks to recent advancements in new technology. A high consumer demand for electric...
Read moreSpirent AI test solution receives top honors at Interop Tokyo 2024
Bangalore – June 14, 2024 – Spirent Communications, the leading provider of test and assurance solutions for next-generation devices and...
Read moreCadence and Samsung Foundry Accelerate Chip Innovation for Advanced AI and 3D-IC Applications
• Cadence.AI digital and analog tools optimized for advanced node SF2 gate-all-around (GAA), driving enhanced quality of results and accelerating...
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Infineon receives German Brand Award for “Corporate Brand of the Year”
Munich, Germany – 13 June 2024 – Today, Infineon Technologies AG received the German Brand Award in the renowned “Best...
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Eurotech announces BestNet OM3 LSZH MTP/MPO Fan-out cables
Bangalore – June 13, 2024 – Eurotech Technologies, a leading provider of fiber optic solutions, today introduced a wide range...
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Anritsu, in Collaboration with Sony Semiconductor Israel, Acquires Industry-First GCF Certification for Non-terrestrial Network (NTN) NB-IoT RF Conformance Testing
11/06/2024 Anritsu Corporation announces that the first NTN NB-IoT RF conformance tests have been validated on the New Radio RF...
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