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Xilinx Doubles Industry’s Highest Capacity Device to 4.4M Logic Cells, Delivering Density Advantage that is a Full Generation Ahead
Virtex UltraScale extends device density lead from 2x at 28nm to 4x at 20nm, using advanced 3D IC technology to...
Read moreMicrochip Earns Top Industry Award in India
Company Named "Best Electronic System Design Company" in SiliconIndia Leadership Awards December 2013, Bangalore, India – Microchip Technology Inc., a...
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Christopher Larocca Joins OK International as President
GARDEN GROVE ― December 2013 ― OK International today announced that Christopher Larocca will lead OK International as its President,...
Read moreSu-Kam Power Systems Announces Alliance with Trojan Battery Company to Strengthen Solar and Inverter Portfolio in India
1-The companies have launched a co-branded Su-Kam/Trojan INV-150 deep-cycle battery in India to power Su-Kam’s solar and inverter product portfolio...
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STMicroelectronics Reveals Advanced MEMS Accelerometers Engineered to Withstand Stresses of Modern Mobile Life
Innovative design boosts the sensor’s thermal and mechanical stability to deliver robust high performance in ultra space-saving footprint India, December,...
Read moreAnalog Devices India to conduct Live Webinar on Computer Vision Solutions
Webinar to provide insights into applications, processors and software solutions for next-gen Industrial vision systems Bangalore, India, December, 2013:...
Read moreTE Connectivity introduces locally designed and manufactured AMPMODU breakaway headers for PCB
Bangalore, December, 2013: TE Connectivity (TE), a global leader in providing connectivity solutions, today announced the introduction of AMPMODU breakaway...
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