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Essemtec to Debut New Small Form Factor SMT Assembly System at APEX
Essemtec, the Swiss manufacturer of production systems for electronic assembly and packaging, will exhibit in Booth #1211 at the IPC...
Read moreMediaTek Reveals the Future of Premium Wireless Connectivity With Its New MT7615 SoC
802.11ac Wave2 chipset with MU-MIMO support designed for high-end home gateway, set-top box, video bridge, router and enterprise-class AP New...
Read moreSTMicroelectronics Begins Shipping Next-Generation Ultra-HDp60 STB Chips
Quad-core SoCs reach lead customers with HEVC 10-bit resolution and VP9 New Delhi, January 7, 2015 – STMicroelectronics , a...
Read moreBroadcom Enables New Denon Google Cast™ Ready Multi-room Wireless Sound System
Delivers Seamless Whole Home Audio Streaming over Wi-Fi LAS VEGAS, Jan. 6, 2015 - CES International 2015 -- Broadcom Corporation...
Read moreViewSonic Introduces New Visual Display Technology Solutions at CES 2015
From Ultra HD 4K Monitors and Feature Rich Projectors, to the Most Comprehensive Line-up of VDI and Commercial-Grade Large Format...
Read moreMediaTek Introduces MT2601 in Support of Google’s Android Wear Software
Higher energy efficiency and reduced component count of MT2601 in relation to competition translate into significant cost, size and usage...
Read moreNI Trend Watch 2015 Explores Internet of Things Impact
NI Investigates Top Trends to Help Engineers Optimize Applications Across Diverse Industries India, Bangalore, – Jan 7, 2015–NI, the provider...
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