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TI introduces first fully integrated mono, Class-D audio amplifier for eCall, instrument cluster and telematics
Integrated diagnostics and load-dump protection provide reliability and simplify design Bangalore, 27th August 2014- Texas Instruments (TI) introduced the industry's first...
Read moreHFR Chooses WebNMS to Deliver Carrier Ethernet Mobile Network Solutions with End-to-End Management
HA-800 Series of Carrier Ethernet Systems Integrates the WebNMS Carrier Ethernet Management Solution for End-to-End CE Service Activation and Assurance...
Read moreFull Compliance with Military Temperature Specification Planned for Altera 20 nm FPGA and SoC Devices
Mil Temp-Qualified Arria 10 FPGAs and SoCsAllowMilitary Customers to Make Early Specification Decisions in Designing Avionics, Radar and other High...
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Speedprint to Showcase New Features for the SP710 Screen Printer at SMTAI
TAMPA, FL ― August 2014 ― Speedprint Technology will display the award-winning SP710avi Screen Printer in Booth #825 at SMTA...
Read moreMODE-GAP Drives World Record for Highest Data Transmission Rate
MODE-GAP, the European collaborative R&D project, has been officially recognised by the Guinness Book of Records for achieving the highest...
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FTDI Partners with MCCI for Embeded SoC Products
26th August 2014 – FTDI Chip is pleased to announce that its technology partnership with MCCI® Corporation, a leading developer of USB drivers and...
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TVS Diode Array Series from Littelfuse Combine ESD Protection with Common-Mode EMI Filtering to Save Cost and Space
Suppress EMI and protect against ESD damage in systems with high-speed differential serial interfaces China, Beijing, August 26, 2014 — Littelfuse, Inc.,the...
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