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AMD EPYC CPUs Now Power SAP Applications Hosted on Google Cloud
Critical SAP Business Suite workloads now run on AMD EPYC processor-powered Google Cloud N2D offering, delivering impressive performance and energy...
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CUI Devices Expands Dc Fans and Blowers Lines with New Smaller Frame Sizes
CUI Devices’ Thermal Management Group today announced the continued expansion of its dc fans and blowers product lines with new...
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TE Connectivity ranks No. 8 among Fast Company’s Best Workplaces for Innovators
In recognition of its global culture designed to empower teams to advance important technological trends, TE Connectivity, a world leader...
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Renesas Introduces R-Car S4 Starter Kit That EnablesRapid Software Development for Automotive Gateway Systems
Starter Kit Can be Combined with the Open-Source R-Car S4 Whitebox SDKto Speed Up Prototyping Renesas Electronics Corporation (TSE:6723), a...
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Integrated VRM power stage provides up to 140 A peak
Flex Power Modules announces their new BMR511, a two-phase power stage for Voltage Regulator Module (VRM) solutions. With a footprint...
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Honeywell Introduces Cloud-Based Digital Twin for Efficient and Secure Up-To-Date Testing
Honeywell's new Digital Prime promotes safer engineering while minimizing risk, disruption, and downtime for operators Pune, July 11, 2023 -- Honeywell (NASDAQ: HON), today...
Read moreApplied Materials Advances Heterogeneous Chip Integration with New Technologies for Hybrid Bonding and Through-Silicon Vias
New materials and systems enable chipmakers to increase the performance and reliability of hybrid bonding, the industry’s most advanced interconnect...
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