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IESA Vision Summit 2016 to provide a platform to identify the Next Era of ‘Make in India’ Opportunity in the Indian ESDM Ecosystem
Under the theme ‘Indian Semiconductor and ESDM Ecosystem: Scaling Up For $400B Make in India Opportunity’ Bangalore January 11, 2016–...
Read moreMicrochip offers award-winning MPLAB® XC PRO compilers in low-cost, renewable monthly subscription license
With the ability to license PRO compiling optimisations on an as needed basis, embedded system designers enjoy profound flexibility 19...
Read moreSTMicroelectronics Announces Industry’s Highest-Frequency, Widest-Range Microwave Integrated RF Synthesizer
New Delhi –India , January 19, 2016–STMicroelectronics’new STuW81300 microwave integrated wideband RF synthesizer covers the RF frequency range from 1.925GHz...
Read moreTelit LTE IoT Modules for North America and Europe Expand 4G Portfolio in CAT-1 and CAT-4 Standards
New Delhi, January 19, 2016– Telit, a global enabler of the Internet of Things (IoT), today announced five new LTE...
Read moreHUBER+SUHNER unveil innovative new range of high speed radio frequency test components and VNA test leads at DesignCon 2016
At DesignCon 2016 in Santa Clara, California, leading manufacturer of Global connectivity solutions, HUBER + SUHNER, will unveil innovative new...
Read moreAGS Transact Technologies to start local ATM production
ATMs for rural areas jointly developed by Wincor Nixdorf and AGS New Delhi, January18, 2016:Inspired from the government’s ‘Make in...
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Germany’s Minister of Transport Dobrindt learns about the future of the car
Munich, Germany – January 18, 2016 – The German Federal Minister of Transport and Digital Infrastructure Alexander Dobrindt acknowledges the...
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