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40V, 3.5A µModule Regulator is FMEA Compliant, Operates up to 150°C Junction Temperature
MILPITAS, CA - June 30, 2016 - Linear Technology introduces the LTM8003, a step-down DC/DC µModule® regulator with a 40V...
Read moreViaSat Opens New Research & Development Centre in Chennai, India
NEW DELHI, India – June 30, 2016 – ViaSat Inc., a global broadband services and technology company, today inaugurated its...
Read moreIAR Systems extends code analysis for applications based on Texas Instruments’ MSP430 MCUs
Uppsala, Sweden—June 30, 2016—IAR Systems® announces a new version of its development tools IAR Embedded Workbench® for Texas Instruments MSP430,...
Read moreFast, Compact Molex Nano-Pitch I/O Interconnect System Now Shipping from Mouser
June 30, 2016 – Mouser Electronics, Inc. is now stocking the Nano-Pitch I/O™ interconnect system from Molex, LLC. The system’s...
Read moreKDDI in Japan Selects Gemalto’s Connected Cars and IoT Solution
Solution includes remote subscription management and embedded SIM AMSTERDAM, June 30, 2016 - Gemalto (Euronext NL0000400653 GTO), the world leader...
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Henkel’s High Compliance GAP PAD HC 5.0 Provides Excellent Thermal Management Performance for Applications with Increased Power Densities
June 29, 2016 – Henkel Adhesive Technologies’ Electronics business has developed and launched the latest product in its line of...
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Allegro MicroSystems, LLC Announces New Three-Wire, True Zero-Speed, Surface Mount Magnetic Speed Sensor IC
Design Allows for Ease of Use for PCB Applications Over Typical SIP Based Packages Worcester, MA – June 2016 – In...
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