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OMC launches new Micro Series LEDs
For miniaturised indication and display applications at EDS Blue, Green, Red LEDs among best performance/size ratio on market October...
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PiBond pioneers a new material approach for MEMS and 3D IC manufacturing
Pibond is awarded patent for its SAP technology platform. © Pibond PiBond today announced the latest...
Read moreHarwin launches new Pogo Pin contacts and new range of SMT contact pads at EDS 2016
Spring-loaded pins suit multiple applications including wearables; new gold finish S70 SMT contact pads prolong device life Portsmouth, UK,...
Read moreu-blox announces plans to support Verizon’s new LTE Cat M1 network for IoT by end of 2016
Thalwil, Switzerland – October 20, 2016 – u-blox (SIX:UBXN), a global leader in wireless and positioning modules and chips, today...
Read moreAmpleon opens RF Energy Competence Center in Hefei
Nijmegen, The Netherlands and Hefei, People’s Republic of China – Ampleon today announced the opening of its RF Energy Competence...
Read moreFirst MediaTek-Powered Smartphone Launched by Verizon Wireless
New LG smartphone with MediaTek’s premium Helio P10 chipset debuts on Verizon network BANGALORE, India – October 20, 2016 –...
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Mouser Electronics Showcases Newest Technologies at ARM TechCon 2016
October 19, 2016 – Mouser Electronics, Inc., the industry’s leading New Product Introduction (NPI) distributor with the widest selection of...
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