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Qorvo® and ubisys Team to Deliver First IoTivity Platform on a Multi-stack Chip
Enables seamless device-to-device connectivity and provides path to consolidation of IoT standards GREENSBORO, NC - January 4, 2017 - Qorvo®,...
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ASUS relies on Infineon REAL3™ image sensor chip to bring Augmented Reality into compact smartphones
The ASUS Zenfone AR is the world’s flattest smartphone that offers a 3D Time-of-Flight (ToF) camera....
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Maxim Announces Industry’s First Remote Tuner Solution with Single Hardware Platform Supporting Worldwide Radio Standards for Automotive Applications
MAX2175 RF to Bits® tuner-based solution reduces cables and simplifies vehiclehead unit design San Jose, CA—January 5, 2017—Using the remote...
Read moreNI Automated Test Outlook Reviews Test Approaches Needed in Era of Smart Devices
Guest Editor Dr. James Truchard examines top test and measurement trends Bangalore, India – January 5, 2017 – NI, the...
Read moreRetune DSP Multi-Microphone Beamforming and Echo Cancellation Now Available for Cadence Tensilica HiFi Audio DSPs
SAN JOSE, Calif., and COPENHAGEN, January 4, 2017—Cadence Design Systems, Inc. (NASDAQ: CDNS) and Retune DSP today announced that Retune...
Read moreCadence and Dolby Collaborate to Enable the World’s First TVs Featuring Dolby Atmos Technology
Cadence Tensilica HiFi DSP for Audio Becomes First IP Core to Support MS12 v2.0 Multistream Decoder SAN JOSE, Calif., January...
Read moreTata Elxsi announces partnership with DISTI for feature-rich 3D automotive UX
LAS VEGAS, CES- 04 2017- Tata Elxsi, a leading global services design and technology services provider for the automotive industry,...
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