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Telit to Demonstrate Multiple Live Network Applications Around NBIoT at Mobile World Congress 2017 with Ericsson, Nokia and Telefonica
Telit returns to Mobile World Congress Barcelona (Hall 5, Booth 5E61) to showcase market-ready narrow-band IoT applications together with ecosystem...
Read moreEmbedded World 2017: Real Design Ideas, Virtual Reality Tours and a chance to win development tools
Visit Mouser on booth 4A Stand 101, Nuremburg Messe March 14-16 March 01, 2017 – Mouser Electronics, Inc., the New...
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ER2224 Thermally Conductive Resin
ER2224 Epoxy potting compound is a highly thermally conductive resin (0.8 W/m*K) which also offers strong thermal cycling properties. It...
Read moreNew Development Kits from Industry-leading suppliers and a Comprehensive Suite of Solutions are available at the element14 booth at the India Electronics Week 2017
Bangalore, India – Thursday 2nd March: element14, an authorised distributor for leading industry brands such as Analog Devices, Molex, Microchip, NXP Semiconductors, TE...
Read moreEPCI Call for Papers for the first Passive Component Networking Days Symposium (PCNS)
Mar 12017 Lanskroun, Czech Republic....The European Passive Components Institute (EPCI) is pleased to announce a Call for Papers for the...
Read moreAnalog Devices Extends Autonomous Driving Leadership
With Drive360TM 28nm CMOS RADAR Technology Platform Bangalore, 1st March 2017 — Analog Devices, Inc. (ADI) today announced the Drive360TM...
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Huawei’s NFV Solution Awarded Best Technology Enabler at MWC 2017
Today at Mobile World Congress 2017 in Barcelona, Huawei's NFV solution was awarded Best Technology Enabler....
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