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HUBER+SUHNER set to make its mark at electronica China with the latest connectivity solutions for industrial, communication and transportation markets
HUBER+SUHNER will display a wide variety of technologies and solutions for the industrial, communications and transportation markets at electronica China...
Read moreNXP Launches the World’s Smallest Single-chip SoC with Integrated Microcontroller for Drones, Robots, Power Tools, DC Fan and Healthcare Applications
New System-on-Chip Is Part of NXP’s Strategy to Extend its 8-bit Family of Microcontrollers for the Broad Market; SoC Includes...
Read moreAlibaba Collaborating with Intel on an FPGA-based Solution to Help Customers Accelerate Business Applications
Alibaba Cloud (Aliyun), has announced a pilot program with Intel for a cloud-based FPGA (field programmable gate array) acceleration service...
Read moreTata Elxsi Partners with DiSTI to Produce e-Cockpit Demonstrator
Tata Elxsi joins DiSTI’s partner program and adopts GL Studio for their UI demonstrations Bangalore, India (March 13, 2017) –...
Read moreToradex announces its participation in NXP’s early access program for the i.MX 8QuadMax applications processor
13 March 2017, Horw, Switzerland: Toradex is proud to announce its participation in the early access program for the new NXP® i.MX 8QuadMax...
Read moreAutomotive-Compliant Dual MOSFETs from Diodes Incorporated Minimize Power Losses to Deliver Cost-Effective High-Efficiency Solutions
Plano, Texas – March 13th, 2017 – Featuring low figure-of-merit on-resistance and gate charge specifications, the latest 40V and 60V...
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New modules in 62 mm package enable higher power density
Munich, Germany – March 10, 2017 – Infineon Technologies AG is expanding its offering of 62 mm IGBT modules. The...
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