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IAR Systems delivers major update of ARM development tools
Latest version of the proven development tools IAR Embedded Workbench for ARM offers C11 and C++14 language standard support as...
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Indium Corporation to Feature Versatile, Stable, Low-Voiding Indium8.9HF Solder Paste at SMT Hybrid Packaging 2017
Indium Corporation will feature its void-reducing Indium8.9HF Solder Paste to help customers Avoid the Void® at SMT Hybrid Packaging May...
Read moreInnovation in Diverse, Fast Moving and High-Profile Sectors for ON Semiconductor at Embedded World
Enabling technologies and unique tools to speed and simplify design and development in the IoT, portable device power delivery and...
Read moreHigh density power and signal Molex Picoflex® ribbon Connectors save space in high-vibration and shock environments – now available from TTI, Inc.
Suits automotive, industrial and consumer applications; reliable solution when flat ribbon connectors unsuitable; new Series reverse footprint SMT headers March...
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Maxim’s nanoPower Boost Regulator
Delivers Industry’s Longest Battery Life and Smallest Solution Size for Wearable and Consumer IoT Designs MAX17222, which features 300nA IQ...
Read moreHUBER+SUHNER set to make its mark at electronica China with the latest connectivity solutions for industrial, communication and transportation markets
HUBER+SUHNER will display a wide variety of technologies and solutions for the industrial, communications and transportation markets at electronica China...
Read moreNXP Launches the World’s Smallest Single-chip SoC with Integrated Microcontroller for Drones, Robots, Power Tools, DC Fan and Healthcare Applications
New System-on-Chip Is Part of NXP’s Strategy to Extend its 8-bit Family of Microcontrollers for the Broad Market; SoC Includes...
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