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Telit and OT-Morpho Partner for Opportunities in the New Era of Device Provisioning on A Global Scale for the Internet of Things
London, June29, 2017 – Telit, a global enabler of the Internet of Things (IoT), together with OT-Morpho, a world leader...
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Midea Group to invest ₹800 Crore to setup manufacturing facility in India
The Manufacturing facility will come up over an acquired area of 43 acres To set up R&D Center to develop...
Read moreMouser Signs Global Agreement with ITT Cannon to Distribute Commercial and Industrial Interconnect Solutions
June 29, 2017 – Mouser Electronics, Inc., the authorized global distributor with the newest semiconductors and electronic components, announces a...
Read moreSTMicroelectronics and Security Platform Inc. to Combine Security Expertise for Safe, Trusted, and Easy-to-Use IoT Devices
- Proven and standards-compliant authentication ICs from ST and embedded-security software by Security Platform to create complete drop-in solutions for...
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Qualcomm Announces New Fingerprint Sensors That Work Under Glass, Display & Metal
Qualcomm has announced its next generation of ultrasonic fingerprint sensors during Mobile World Congress Shanghai. The new Qualcomm Fingerprint Sensors...
Read moreON Semiconductor and PowerSphyr Announce Agreement to Accelerate Development of Universally Compatible Wireless Power Solution
DANVILLE, Calif. – June 29, 2017 - ON Semiconductor (NASDAQ:ON) and PowerSphyr Inc. today announced an agreement to develop and market one of the industry’s most...
Read moreHalf brick 150 Watt DC-DC converters offer ultra wide 8:1 input range
June 29th 2017 – XP Power today announced the QSB150 series of 150 Watt half brick DC-DC converters aimed at...
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