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Microchip Expands its mSiC™ Solutions with the 3.3 kV XIFM Plug-and-Play mSiC Gate Driver to Accelerate the Adoption of High-Voltage SiC Power Modules
The highly integrated 3.3 kV XIFM plug-and-play digital gate driver is designed to work out-of-the-box with high-voltage SiC-based power modules...
Read moreAnalog Devices Strengthens Capacity and Resiliency Through Expanded Partnership with TSMC
India, February 23, 2024—– Analog Devices, Inc. (Nasdaq: ADI) announced today that the company has made a special arrangement with...
Read moreLANXESS starts up expanded plant for sustainable sulfur carriers
High-performance additives for lubricants are mainly used in the metalworking industry Mumbai, February 22, 2023 – Specialty chemicals company LANXESS...
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ROHM’s New Thermal Printhead Provides Clear Printing at High Speeds, Even on a Single-Cell Li-Ion Battery
Novel design contributes to greater miniaturization, lighter weight, and improved energy savings ROHM Semiconductor today introduced the KR2002-Q06N5AA thermal printhead,...
Read moreRenesas Develops Embedded MRAM Macro that Achieves over 200MHz Fast Random-Read Access and a 10.4 MB/s Fast Write Throughput for High Performance MCUs
High-speed Circuit Technologies and Silicon Measurement Results of MCU Test Chip Presented in ISSCC 2024 TOKYO, Japan, February 21, 2024...
Read moreSpirent 5G outlook report : 5G Standalone and Private Networks ready to be unleashed
Bangalore – February 22, 2024 – Spirent Communications, the leading provider of test and assurance solutions for next-generation devices and...
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Infineon sells manufacturing sites in Cavite, Philippines and Cheonan, South Korea to ASE, strengthening the strategic partnership of the two companies
Munich and Taipei – 22 February, 2024 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) and ASE Technology Holding...
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