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Leading Passive Components for Space Symposium Call For Papers Now Open
Technical conference to take place 9-12 October 2018 | ESA\ESTEC Noordwijk, The Netherlands. February 2018:… European Space Agency (ESA) Space Passive...
Read moreAvnet Silica and Arkessa Accelerate IoT Application Deployment for OEMs and Enterprises Providing Cellular Connectivity Services
Poing, Germany, 26th February 2018 – Avnet Silica, an Avnet company (NYSE: AVT), today announced a collaboration with Arkessa, a...
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Microchip simplifies industrial-grade Linux® designs with SAMA5D2 MPU-based System on Module (SOM)
Power management, non-volatile boot memory, Ethernet PHY and high-speed DDR memory are integrated on a small, single-sided PCB enabling smaller,...
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ZTE to Launch C-V2X Module to Drive Commercialization of C-V2X
C-V2X Module Aims to Utilize Qualcomm 9150 C-V2X Chipset Solution in Next Generation Vehicles and Roadside Infrastructure [caption id="attachment_40329" align="alignright"...
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Intel Ships Industry’s First 58G PAM4-Capable FPGA Built for Multi-Terabit Network Infrastructure and NFV
Intel today announced it has begun shipping its Intel® Stratix® 10 TX FPGAs, the industry’s only field programmable gate array...
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Mouser Now Stocks Molex’s Power-Boosting Triple-Band Wi-Fi Antenna for IoT and M2M Applications
February 26, 2018 – Mouser Electronics, Inc., the industry's leading New Product Introduction (NPI) distributor with the widest selection of...
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ON Semiconductor Expands Solutions for Industrial IoT, Smart Home and Wearables
Significant expansion of sensor and software capabilities expands key vertical IoT applications addressed by the IoT Development Kit (IDK) [caption...
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