Altera Demonstrates Interlaken Connectivity with Cavium OCTEON® Multicore Processors
Hong Kong, August 1, 2013—Altera Corporation announced the interoperability of its Interlaken intellectual property (IP) core on Stratix® V FPGAs...
ROHM Innovations for Better Tomorrow
Innovations for Better Tomorrow ROHM Semiconductor Initiatives for the Automotive-electronics Sector Initially developing a large number of ICs for...
IPC and JPCA Release Industry’s First Design Guidelines for Printed Electronics
BANNOCKBURN, Ill., USA, July 30, 2013 — The electronics manufacturing industry’s first design guidelines for printed electronics, IPC/JPCA-2291, Design...
Indium Corporation Technology Expert to Present at ICEPT
Indium Corporation’s Dr. Ning-Cheng Lee, Vice President of Technology, will give two presentations and teach a professional development course at the International...
STMicroelectronics, ARM and Cadence Improve Tool and Model Interoperability with Three Joint Contributions to Accellera Systems Initiative
New Delhi, India, July 29, 2013 -- STMicroelectronics, ARM and Cadence Design Systems, Inc. announced three new contributions to the...
First Canadian-made Siemens wind turbine blade shipped
Siemens has officially shipped its first ‘made-in-Canada’ wind turbine blade from its manufacturing facility in Tillsonburg, Ontario. After a send-off...
Pickering Interfaces Releases New Edition of the Book – “LXImate”
A Practical Guide to the LXI Standard Pickering Interfaces, a leading provider of signal switching and conditioning solutions, announces the...
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