Toshiba and SanDisk partnering to produce high-power ‘3D’ memory
Toshiba and SanDisk are looking to the future of memory storage, and have revealed that they are joining forces to...
Infineon Extends its Portfolio of Reverse Conducting IGBTs with a 650V Class Device– RC-H5 Reduces Switching Losses by 30 PercentEnabling Greater EnergyEfficiency
Neubiberg, May 15, 2014 – Infineon Technologies AG has extended the latest generation of reverse conducting IGBTs (Insulated Gate Bipolar...
Mouser Stocking Analog Devices AD9680 ADC Evaluation Boards
May 15, 2014 – Mouser Electronics, Inc. is shipping the new Analog Devices AD9680 Evaluation boards, the AD9680-1000EBZ. The AD9680...
Expert comment on the Indian election result
If you are looking for expert comment on the Indian election results Warwick Business School Assistant Professor Sourindra Banerjee researches...
HGI Moves a Step Closer to Making Interoperable Smart Home a Reality
Standards organisation publishes software modularity requirements for smart home HGI Open Platform 2.0 15 May 2014. HGI, a leading organisation...
ThinPAK 5×6 Brings Smallest CoolMOS™ MOSFETsEver into Adapters, ConsumerElectronics and Lighting Applications
Neubiberg, Germany –May 15, 2014– Infineon Technologies introducesa new leadless surface mounted(SMD) package for CoolMOS™ MOSFETs named ThinPAK 5x6. Chargers...
Telit M2M Technology to Help Turtles and Tourism on North Carolina Coast
The Telit HE910 module will communicate nest temperature and movement data to more accurately predict hatching of threatened and endangered...
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