FCI Introduces Economical and Lead-free Un-shrouded EconoStik™ 2.54mm Headers
SINGAPORE (Sep 09, 2014) —FCI, a leading supplier of connectors and interconnect systems, is proud to introduce the new and...
Training the next generation of engineers with ANSYS
Campus-wide solutions equip future engineers with advanced engineering skills to tackle real-world problems PITTSBURGH, Sept. 9, 2014 – As engineering...
Tata Elxsi—Technology Showcase and Product launch at IBC2014
Bangalore- 10th September: Tata Elxsi, a leader in global design and technology services across the Broadcast industry, today announced its...
MultiTech Systems First to Leverage Telit m2mAIR Cloud-Ready Modules
Telit selects award-winning MultiTech Quick Carrier™ USB-D modem to demonstrate important milestone in the Internet of Things Made Plug &...
Maxim Integrated Powers Next-Generation Xilinx® UltraScale™ FPGAs
Maxim Integrated became the lead supplier to offer power management products for three Xilinx FPGA reference designs. New Delhi, India...
Telit Introduces Cloud-Ready Modules
Embedded device WISE API and m2mAIR Cloud service simplify the creation of applications for m2m and the Internet of Things...
eInfochips shrinks design cycles by six months for TI Processors
To offer engineering design services to leapfrog ramp-up time, in addition to off-the-shelf Evaluation Kits Ahmedabad, 9th September 2014: eInfochips, a leading...
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