Spansion Powers Xilinx Zynq-7000 All Programmable SoCs with New Family of PMICs
Spansion® MB39C50XSeries Reduce Power Consumption and Accelerate Design Productivity SUNNYVALE, Calif., Sept. 9, 2014 -- Spansion Inc., a global leader...
IESA signs MoU with Taipei Computer Association to promote ESDM
Importance to be given towards creation of new markets, increase job opportunities through skill enablement and contribute to the ESDM...
Tata Elxsi Showcases ‘Prime’, an innovative cloud ready DVB-RDK Solution at IBC 2014
Bangalore, Sep 11, 2014 – Tata Elxsi, a world leader in product engineering services across the broadcast industry and a...
Synopsys RSoft™ OptSim™ Circuit for Design of Next-Generation Photonic Integrated Circuits (PICs)
Highlights: OptSim Circuit is an innovative tool to automate design of next-generation single- and multi-stage photonic integrated circuits (PICs) Models...
Tata Elxsi—Technology Showcase and Product launch at IBC2014
Bangalore- 11th September:Tata Elxsi, a leader in global design and technology services across the Broadcast industry, today announced its planned...
Minimizing Voiding in QFN Packages Using Solder Preforms
According to Prismark Partners, the use of quad-flat no-leads (QFNs) is growing faster than any package type except for flip-chip...
SolderStar Exhibit its Profiling Solutions for Reflow, Wave, Selective and Vapour Phase Soldering at Productronica India
SolderStar Ltd, one of the world’s leaders in thermal management systems, with an extensive portfolio including profiler equipment and software...
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