Essemtec to Debut New Small Form Factor SMT Assembly System at APEX
Essemtec, the Swiss manufacturer of production systems for electronic assembly and packaging, will exhibit in Booth #1211 at the IPC...
New test and programming strategies for Intel processors
GOEPEL electronics introduces new test and programming strategies for Bay Trail processors from Intel® GOEPEL electronics announces the development of...
MediaTek Reveals the Future of Premium Wireless Connectivity With Its New MT7615 SoC
802.11ac Wave2 chipset with MU-MIMO support designed for high-end home gateway, set-top box, video bridge, router and enterprise-class AP New...
Global 3D Camera Market is Expected to Reach $7.6 Billion by 2020
By Allied Market Research According to a new report by Allied Market Research titled, "Global 3D Camera Market - Size,...
STMicroelectronics Begins Shipping Next-Generation Ultra-HDp60 STB Chips
Quad-core SoCs reach lead customers with HEVC 10-bit resolution and VP9 New Delhi, January 7, 2015 – STMicroelectronics , a...
Broadcom Enables New Denon Google Cast™ Ready Multi-room Wireless Sound System
Delivers Seamless Whole Home Audio Streaming over Wi-Fi LAS VEGAS, Jan. 6, 2015 - CES International 2015 -- Broadcom Corporation...
ViewSonic Introduces New Visual Display Technology Solutions at CES 2015
From Ultra HD 4K Monitors and Feature Rich Projectors, to the Most Comprehensive Line-up of VDI and Commercial-Grade Large Format...
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