FCI Augments RotaConnect® Solutions
SINGAPORE (May 12, 2015) — FCI, a leading supplier of connectors and interconnect systems, today announced the extension of the...
Altera Announces New Spectra-Q Engine for Industry-leading Quartus II Software to Accelerate FPGA and SoC Design
Hong Kong , May 12, 2015 – Altera Corporation unveiled its Spectra-Q™ engine, a new technology at the heart of...
PrimePACK™ Combines latest IGBT5 with .XT Interconnection Technology for Higher Lifetime and Power Density
Munich, Germany –May 12, 2015 – At this year's PCIM 2015 trade show Infineon Technologies AG will present the latest...
An electrifying combination: hybrid technology from Porsche and Bosch
Stuttgart – With the 918 Spyder, the Panamera S E-Hybrid and the Cayenne S E-Hybrid, Porsche was the first car...
RAPOO A200 Bluetooth mini-speaker
The A200 is a feat of engineering, with 4W amplified output and resistant to splashes, dust and shock. NEW DELHI,...
MAIT and CHiPS Signs MoU in Chief Minister Dr Raman Singh’s Presence in Raipur, Chhattisgarh
Bengaluru, May 12th 2015: MAIT, an apex body representing ICT Industry in India signed the Memorandum of Understanding (MoU) with...
Infineon 3D Magnetic Sensor with High Accuracy Reduces Power Consumption in Consumer and Industrial Applications
Munich, Germany – May12, 2015 –Infineon Technologies AG announced its 3D magnetic sensor TLV493D-A1B6 that features highly accurate three-dimensional sensing...
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