TI’s new Sub-1 GHz solution spans 20 km on a coin cell
TI's SimpleLink™ Sub-1 GHz CC1310 wireless MCUs now available with the lowest power and high RF performance for the IoT...
IRS2005 HVIC complements Infineon’s driver IC family for mid- and low-voltage motor drives, delivers high power efficiency and increases system reliability
Munich, Germany – December 3, 2015 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) expands its 200 V driver...
Vishay Intertechnology NGR Series Neutral Ground Resistors Now Available for CSA Code Special Inspection
MALVERN, Pa. — Dec. 3, 2015 — Vishay Intertechnology, Inc. announced that Vishay Milwaukee (a product line of Vishay Dale...
u-blox inaugurates new R&D center in Tampere, Finland
Initial focus on GNSS technology development Thalwil, Switzerland and Tampere, Finland – December 2, 2015 – u-blox, a global leader...
Dialog Semiconductor Increases Market Share of Mobile Rapid Charging with Latest Samsung AC/DC Adapter Design Win
Dialogs power management chipset enables Samsungs Adaptive Fast Charging compact wall adapter to deliver market-leading efficiency with best in class...
More-than-Moore: Can electronics packaging keep up?
Advanced microelectronics are moving on from the Moore’s Law era to be More-than-Moore. Denser chips have higher internal and external...
Quantum computer made of standard semiconductor materials
Magnetic field helps qubit electrons store information longer Physicists at the Technical University of Munich, the Los Alamos National Laboratory...
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