Experience Mouser’s Support for the Full Design Cycle at Embedded World 2016
Latest ICs and sensors; powerful design tools; dev tool lottery Visitors to Mouser’s booth, Stand A4-101, Hall A4, at the...
Barry Industries and Modelithics Develop Broadband 5mm C-QFN Package Model to 40GHz
Attleboro, Massachusetts USA – Barry Industries and Modelithics, Inc. have published a report detailing the broadband performance of Barry's 5mm high...
X-FAB Design Award Aims to Encourage Innovative Thinking in Semiconductor Manufacture
ERFURT, Germany, Feb. 3, 2016 – Advancing semiconductor technology, X-FAB Silicon Foundries has announced the establishing of its X-Cite Award Program. X-Cite will...
Indium Corporation to Feature Low-Voiding Solder Paste at IPC APEX 2016
Indium Corporation will feature its void-reducing no-clean solder pastes to help customers Avoid the Void™ at IPC APEX Expo, which...
TE Sealed AMPLIMITE D-Subminiature connectors are sealed against water ingress to depth of 1 meter- now available in Europe through TTI
Meets MIL-DTL-24308, environmentally sealed to IP67 against water and dust;standard and high-density versions available; suits marine, aerospace and defence applications...
Ultra compact global 3G/2G cellular module ideal for tracking and IoT applications
Constrains BOM cost and logistics complexity by selecting single 3G/2G module Thalwil, Switzerland – February 4, 2016 – u-blox, a...
Koh Young Announces Sale of 1000th 3D AOI System
Seoul, South Korea – Koh Young Technology announces the delivery of their 1000th 3D in-line Inspection AOI system, a Zenith model;...
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