ARM Cortex-R8 Processor Trail-blazes 5G Need for Speed
Next generation LTE Advanced Pro and 5G mobile baseband standards and mass storage applications will use the new ARM® Cortex®-R8...
Portronics launches palm-sized ‘Sound Wallet’ Bluetooth Speaker
~Offers mellifluous sound quality and can be paired easily with your iPhone, PDA, iPod, Computer, iPad or any other Bluetooth...
STMicroelectronics and ARCCORE Team Up for Automotive Embedded-Processing Development
Geneva, Switzerland, Gothenburg, Sweden; date -STMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications, and ARCCORE...
Indium Corporation Features “Power-Safe” NC-SMQ®75 Die-Attach Solder Paste at SEMICON China
Indium Corporation will feature “Power-Safe” NC-SMQ®75, the world’s first and only die-attach solder paste suitable for use in non-cleaned clip bond...
Nihon Superior Will Show the Latest Advancements of the SN100C Alloy atIPC APEX EXPO
OSAKA, JAPAN —February 2016—Nihon Superior Co. Ltd., an advanced joining material supplier, will exhibit in Booth #2610 at the IPC...
Semtech & Digimondo Announce Roll-out of LoRaWAN™ IoT Network in Germany
Network deployed over Nuremberg will showcase network performance and IoT Applications for Embedded World 2016 CAMARILLO, Calif., February 18, 2016...
UltraSoC and Lauterbach deliver universal SoC debug environment
Integration enables vendor-independent debug within industry standard toolchain CAMBRIDGE, United Kingdom, and HOEHENKIRCHEN-SIEGERTSBRUNN, Germany, 17th February 2016 - UltraSoC and...
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