Hammond adds new dedicated Arduino and BeagleBone development board enclosures
Released February 22, 2016 Hammond Manufacturing has further extended its family of design-specific plastic enclosures for housing small form factor development...
Digi International Announces Thread-Ready XBee Module
New XBee Module Illustrates Application of Thread Protocol in Industrial Applications and Company's Role in Creating New, Advanced Wireless Solutions...
Bluetooth low energy 4.2 module brings state-of-the-art performance and power efficiency to IoT designs
Sensing and control applications can be embedded on top of the NINA-B1 module stack Thalwil, Switzerland - February 22, 2016...
Infineon and GoerTek optical sensor solutions deliver precise, ultra-lowpower heart rate monitoring forsmart devices
Munich, Germany – February 19, 2016 – Infineon Technologies AG and GoerTek Inc. launched two high-resolution, highly integrated optical sensors....
High-performance Atmel SAMA5D2 Xplained Ultra from element14 for fast prototyping and evaluation
High-performance, ultra low-power ARM MPU kit extends Atmel Xplained concept for industrial, IoT, LED and decorative lighting applications BANGALORE -...
NEC Develops Massive-element Antenna for 5G Base Stations
TOKYO, Feb 22, 2016 - NEC Corporation announced it has developed a prototype of A4-sized massive-element Active Antenna System (AAS)...
STMicroelectronics Showcases STM32 Open Development Environment at Embedded World and Mobile World Congress
More than 20 STM32 Nucleo expansion boards Dozens of STM32Cube and STM32Cube Expansion libraries First STM32 Function Pack for Cloud...
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