Graphene nanoflake-based films developed as thermal interface materials
Researchers at Chalmers University of Technology in Sweden have developed a new approach to cooling electronics using graphene nanoflake-based film....
ITAR-free S band SWaP optimised pallets speed time to market for radar applications
Nigmegen, The Netherlands – 23rd May, 2016 – Ampleon today announced two 400 Watt S band power amplifier pallets designed...
Intersil’s 5A and 3A Power Modules Offer Industry-Leading Power Density and Efficiency
Single-channel, pin-compatible ISL8205M and ISL8202M offer compact solution size for battery-powered industrial and high-end consumer applications Milpitas, Calif., May 23,...
Allegro MicroSystems, LLC Introduces New Quad DMOS Full Bridge PWM Motor Driver IC
Worcester, MA – May 2016 – Allegro MicroSystems, LLC announces a new quad DMOS full-bridge driver IC capable of driving up to...
STMicroelectronics and Autotalks Fuse Satellite Navigation with Vehicle-to-Vehicle and -Infrastructure Communication (V2X)
Combining GNSS with V2X ranging creates “V2X-Enhanced GNSS” to ensure security, accuracy, and reliability of positioning information in difficult urban...
Evaluate Rugged 3D Interface and Weigh Scale with Maxim’s Smart Force Sensor
Maxim Integrated’s low power MAXREFDES82# reference design quickly calculates force and center of mass. New Delhi, India—May 23, 2016—Design engineers can...
Siemens to collaborate with HP Inc. to elevate 3D printing from prototyping to full production
Siemens software to help drive new HP 3D printers’ full potential Multi-material capability to enable assemblies to be replaced by...
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