PiBond pioneers a new material approach for MEMS and 3D IC manufacturing
Pibond is awarded patent for its SAP technology platform. © Pibond PiBond today announced the latest...
Harwin launches new Pogo Pin contacts and new range of SMT contact pads at EDS 2016
Spring-loaded pins suit multiple applications including wearables; new gold finish S70 SMT contact pads prolong device life Portsmouth, UK,...
u-blox announces plans to support Verizon’s new LTE Cat M1 network for IoT by end of 2016
Thalwil, Switzerland – October 20, 2016 – u-blox (SIX:UBXN), a global leader in wireless and positioning modules and chips, today...
Ampleon opens RF Energy Competence Center in Hefei
Nijmegen, The Netherlands and Hefei, People’s Republic of China – Ampleon today announced the opening of its RF Energy Competence...
First MediaTek-Powered Smartphone Launched by Verizon Wireless
New LG smartphone with MediaTek’s premium Helio P10 chipset debuts on Verizon network BANGALORE, India – October 20, 2016 –...
Mouser Electronics Showcases Newest Technologies at ARM TechCon 2016
October 19, 2016 – Mouser Electronics, Inc., the industry’s leading New Product Introduction (NPI) distributor with the widest selection of...
Fujitsu Laboratories Develops New Architecture that Rivals Quantum Computers in Utility
KAWASAKI, Japan, Oct 20, 2016 - Fujitsu Laboratories Ltd. today announced that it has collaborated with the University of Toronto...
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