Inuitive and Bellus3D enable high-quality and cost-effective 3D face scanning for mobile devices
Bellus3D selects Inuitive’s smart sensors hub as streamlined design solution for an affordable 3D face scanning camera for mobile devices....
Qorvo® and ubisys Team to Deliver First IoTivity Platform on a Multi-stack Chip
Enables seamless device-to-device connectivity and provides path to consolidation of IoT standards GREENSBORO, NC - January 4, 2017 - Qorvo®,...
ASUS relies on Infineon REAL3™ image sensor chip to bring Augmented Reality into compact smartphones
The ASUS Zenfone AR is the world’s flattest smartphone that offers a 3D Time-of-Flight (ToF) camera....
Maxim Announces Industry’s First Remote Tuner Solution with Single Hardware Platform Supporting Worldwide Radio Standards for Automotive Applications
MAX2175 RF to Bits® tuner-based solution reduces cables and simplifies vehiclehead unit design San Jose, CA—January 5, 2017—Using the remote...
NI Automated Test Outlook Reviews Test Approaches Needed in Era of Smart Devices
Guest Editor Dr. James Truchard examines top test and measurement trends Bangalore, India – January 5, 2017 – NI, the...
Retune DSP Multi-Microphone Beamforming and Echo Cancellation Now Available for Cadence Tensilica HiFi Audio DSPs
SAN JOSE, Calif., and COPENHAGEN, January 4, 2017—Cadence Design Systems, Inc. (NASDAQ: CDNS) and Retune DSP today announced that Retune...
Cadence and Dolby Collaborate to Enable the World’s First TVs Featuring Dolby Atmos Technology
Cadence Tensilica HiFi DSP for Audio Becomes First IP Core to Support MS12 v2.0 Multistream Decoder SAN JOSE, Calif., January...
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