Electronics Maker, Author at Electronics Maker

Cadence Tensilica HiFi DSP for Audio Becomes First IP Core to Support MS12 v2.0 Multistream Decoder SAN JOSE, Calif., January...

Tata Elxsi announces partnership with DISTI for feature-rich 3D automotive UX

LAS VEGAS, CES- 04 2017- Tata Elxsi, a leading global services design and technology services provider for the automotive industry,...

MediaTek Announces the MT2533D Chipset with Advanced Technology for Smart Headsets, Headphones and Hands-Free Systems

New MT2533D chipset technology delivers crystal-clear voice and music, combined with an ARM Cortex-M4 processor to enable smart device features...

BT and MediaTek Collaborate to Deliver Total Wireless Connectivity for the Home, and Connected World

Adaptive Network promises superior coverage and smart connectivity Bangalore, India – January 4, 2017–MediaTek today announced that BT has selected MediaTek’s...

Microsemi Announces Two New Versions of its High Power TVS Devices to Address Demanding Lightning Protection Requirements in Aircraft

Company’s Unique PLAD Technology Enables Effective Surface-Mount TVS Packaging ALISO VIEJO, Calif.—Jan. 4, 2017—Microsemi Corporation (Nasdaq: MSCC), a leading provider...

Panasonic’s ZK series hybrid capacitors for automotive applications