ASUS relies on Infineon REAL3™ image sensor chip to bring Augmented Reality into compact smartphones
The ASUS Zenfone AR is the world’s flattest smartphone that offers a 3D Time-of-Flight (ToF) camera....
The ASUS Zenfone AR is the world’s flattest smartphone that offers a 3D Time-of-Flight (ToF) camera....
MAX2175 RF to Bits® tuner-based solution reduces cables and simplifies vehiclehead unit design San Jose, CA—January 5, 2017—Using the remote...
Guest Editor Dr. James Truchard examines top test and measurement trends Bangalore, India – January 5, 2017 – NI, the...
SAN JOSE, Calif., and COPENHAGEN, January 4, 2017—Cadence Design Systems, Inc. (NASDAQ: CDNS) and Retune DSP today announced that Retune...
Cadence Tensilica HiFi DSP for Audio Becomes First IP Core to Support MS12 v2.0 Multistream Decoder SAN JOSE, Calif., January...
LAS VEGAS, CES- 04 2017- Tata Elxsi, a leading global services design and technology services provider for the automotive industry,...
New MT2533D chipset technology delivers crystal-clear voice and music, combined with an ARM Cortex-M4 processor to enable smart device features...
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