Indium Corporation Features InFORMS® Reinforced Solder Preforms at APEC 2017
Indium Corporation will feature its reinforced solder alloy fabrications, InFORMS®, at APEC 2017, March 26-30, in Tampa, Fla. InFORMS are...
Honeywell Expands Indoor Air Purifiers Portfolio with Model for Apartment Homes
- Priced at INR 19,990, the new purifier comes with a beautiful design and offers power packed features - Honeywell...
Mobile Payment Pays Off Thanks to ST’s Unique, Complete, and Certified Solution
ST has a complete solution to integrate mobile payment in smartphones and wearable devices. Contactless payment is not new, but building...
Mouser Now Offering Sensirion’s SHTW2 RH and Temp Extension Board for SAMD20 Xplained Pro
February 8, 2017 – Mouser Electronics, Inc., the industry's leading New Product Introduction (NPI) distributor with the widest selection of...
Valens and Lattice Semiconductor Partner to DeliverHDBaseT Reference Design to Support 4K 60Hz 4:4:4 Resolutions
Amsterdam, ISE 2017 – Feb. 7, 2017–Valens, the developer of HDBaseT and founder of the HDBaseT Alliance, announced the availability...
Navilock’s new GNSS receiver series features u-blox’s Untethered 3D Dead Reckoning (UDR) module
The u-blox GNSS module NEO-M8U is at the core of the new GNSS receiver series Thalwil, Switzerland – February 8,...
Telit Supports Shenzhen Mobicom Telematics in Building a More Secure and More Scalable IoT Platform
New Delhi, 8th February 2017: Telit, a global enabler of the Internet of Things (IoT), today announced that Shenzhen Mobicom...
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