TI unveils industry’s smallest 12-V, 10-A DC/DC step-down power solution
Highly integrated SWIFT™ power modules eliminate input and output capacitors to provide best transient performance for space-constrained applications INDIA and...
Avnet Silica to host over 60 demos and exclusive IoT solutions at Embedded World
Poing, Germany, 14 February 2017 – Avnet Silica, an Avnet, Inc. (NYSE: AVT) company, has announced the company will be...
Ultra-low power e-paper displays pivotal in streamlining service automation
A Spur demonstration will be on the Canonical Group Ltd stand, Hall P3 3K31 at Mobile World Congress, 27...
Catch the Next Wave in Silicon Labs’ Connectivity Solutions at Embedded World
Demos Showcase Innovations in Embedded Design, Wireless Sensing, and Mesh, Bluetooth®, Wi-Fi and Proprietary Connectivity AUSTIN, Texas – Feb. 14th,...
Mouser and GSI Technology Enter Worldwide Distribution Agreement
Global Distributor to Offer Four Series of Memory Products February 13, 2017 – Mouser Electronics, Inc., the authorized global distributor...
Telit and Yokogawa to collaborate on new IIoT Architecture
Newly-announced architecture leverages companies’ combined Industry 4.0 expertise to transform business models New Delhi, February 14, 2017 – Telit, a...
Indium Corporation Featured Partners to Run “Live@APEX”
Seven Indium Corporation partners will exclusively run its low-voiding solder products “Live@APEX” throughout the IPC APEX Expo technical conference on...
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