Nextrom’s specialty fiber preform technology
The OFC 12 MCVD/FCVD Deposition System is a very flexible and customizable solution for small-scale specialty fiber preform production. MCVD...
Digi International Introduces Connect Sensor+ for Intelligent Communication in Remote Locations
Cellular Gateway Disrupts the Landscape for Remote Location Monitoring with New Bidirectional Sensor Communication Capabilities MINNETONKA, Minn., March 28, 2017...
Matrix to Showcase its Enterprise Grade, Well-engineered Security Solutions at SECUTECH 2017, Mumbai
Matrix, a leading manufacturer and provider of Telecom and Security solutions, is participating in SECUTECH 2017, Mumbai from 6th to...
Svante Littmarck of COMSOL to Give Plenary Lecture at 2nd Thermal and Fluids Engineering Conference
BURLINGTON, MA (March 28, 2017) — COMSOL, Inc. the leading provider of software solutions for multiphysics modeling, simulation, app...
Bidirectional TVS Diode Arrays from Littelfuse Protect High-Speed Interfaces from Damaging ESD
Ideal for protecting high-speed interfaces like HDMI, USB2.0, USB3.0 and eSATA Beijing, China, March 28, 2017 — Littelfuse, Inc., the...
Mouser-Backed Formula E Team Readies for Tough Race in Mexico
TTI, Molex and Panasonic Join to Sponsor High-Tech Sport, Paving the Way for Technology March 27, 2017 – The Mouser...
ROHM Semiconductor partners with Renesas for GR Peach Design Contest
Bangalore, March 28, 2017:ROHM Semiconductors India was a proud partner of the annual GR Peach Design Contest organized by Renesas....
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