Hua Hong Semiconductor Power Discrete Platform Crosses the 5 Million Wafer Shipments Mark
HONG KONG, Mar 30, 2017 - (ACN Newswire) - Hua Hong Semiconductor Limited ("Hua Hong Semiconductor" or the "Company", together...
Maxim’s PMIC Reduces Solution Size By 50% for Wearable Medical and Fitness Applications
MAX20310 supports a low input voltage of 0.7V to provide wearable PMICs for primary cell architectures San Jose, CA—March 29,...
3 Ways to Achieve Reliable Pneumatic Performance in Extreme Operating Conditions
Extreme operating conditions bring a varied range of challenges for rail operators when keeping their components and systems in operation....
Vishay Intertechnology Automotive Grade Proximity and Ambient Light Sensor Provides Design Flexibility for Gesture Applications
Device Features Drivers for Up to Three External IREDs and High Sensitivity for Long Distance Detection in Compact 4 mm...
D3 Semiconductor Superjunction +FETs™ Push Performance Envelope
New entry into competitive power semiconductor market offers 650V-rated models in a wide variety of package configurations; claims across-the-board, industry-best...
New Alliance Memory 512Mb SDRAMs in 54-Pin TSOP II Package Provide Pin-for-Pin Replacements for Discontinued Micron Technology Devices
SAN CARLOS, Calif. — March 29, 2017— Alliance Memory today introduced two new 512Mb synchronous DRAMs (SDRAM) in the 54-pin...
Indium Corporation Offers One-Source Solution for High-Purity Tin (Sn) Metal Applications
Indium Corporation delivers a single-source solution, from mine to packaging, for high-purity tin materials. The company offers tin in a...
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