Nordson ASYMTEK and Nordson MARCH to Present Papers at Contamination, Cleaning, and Coating Conference in Amsterdam
Carlsbad, CA, USA - 10 May 2017 - Nordson ASYMTEK and Nordson MARCH, Nordson companies (NASDAQ: NDSN), will present papers at the...
Microsemi and Aquantia Announce Production-Ready Multi-Rate Switch Reference Platform
New Optimized Multi-Gigabit Ethernet Solution to be Demonstrated at Interop ITX May 15-19 in Booth #317 ALISO VIEJO, Calif.—May 9,...
Würth Elektronik eiSos expands its terminal series with REDCUBE PLUG for currents up to 120 A
Plugged, not threaded Waldenburg (Germany), 10 May 2017 – With REDCUBE PRESS-FIT, Würth Elektronik eiSos offers high current contacts, which,...
Ampleon showcases LDMOS and GaN RF PA portfolio and high power RF solutions at IMS
Booth 914 – Hawai’i Convention Center, Hawai’i Nijmegen, The Netherlands, May 11th, 2017 – Ampleon today announced its participation at...
“Engineered to last” splicing technology from Fujikura Europe remains superior
World’s first fully automatic fusion splicer provides great ROI for customers and an increased productivity via reduced splice cycles Chessington,...
Smart home and health care devices launched, powered by MediaTek
‘Sure Smart Video Doorbell’ from PiOctave and Health monitoring solution from ‘H100’ from Chainway launched New Delhi, 11 May, 2017–...
Vicor Expands High Voltage Bus Converter Family with New K=1/16, 384VDC-24VDC in a ChiP Package
The new BCM6123TD1E2663Txx is a high-density, high-efficiency, fixed ratioDC-DC convertermodulein a ChiP package, which operates from a 384 VDC nominal...
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