Revolutionary CoolSiC™ Trench MOSFET combining SiC performance with silicon ruggedness
By Dethard Peters, Thomas Basler, Bernd Zippelius, Thomas Aichinger, Wolfgang Bergner, Romain Esteve, Daniel Kueck, Ralf Siemieniec, Infineon Technologies AG...
Diodes Incorporated and Weltrend Semiconductor Announce Industry-First Qualcomm Quick Charge 4 Compliant 27W Reference Design
Reference Design Supports Qualcomm Quick Charge 4 Class A Plano, Texas – November 1, 2017 – Diodes Incorporated, a leading...
The CEO Magazine Awarded Matrix as One of the Top 25 Unified Communication Solution Providers Company
Matrix, an agile manufacturer of feature loaded Telecom and Security solutions, is awarded as one of the top 25 Unified...
Synopsys Accelerates FIPS 140-2 Certification with NIST-Validated Cryptography IP Software Library
Successful Testing of DesignWare Cryptography Software Library Enables Development of Highly Secure IoT Systems Bangalore, Nov. 2, 2017 –...
Thermography that is Smart & Networked !
This is why you too need a thermal imager. In contracting as well as in the industrial sector, you profit...
STMicroelectronics’ STM32H7 Series MCU Leverages the New Platform Security Architecture from Arm to Boost Protection for Connected, Smart Devices
- Platform Security Architecture (PSA) from Arm enhances support for cost-effective state-of-the-art security in the IoT world - ST’s Arm®...
IoTNext 2017 Themed ‘Pilots to Scale’ will Debate and Discuss the Next Wave of IoT Innovation & Deployments
Industry veterans, practitioners, startups and ecosystem enablers come together for India’s premier IoT event to take a deep dive on...
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