New SSO10T TSC top-side cooling package for power MOSFETs enables highest efficiency for modern automotive applications
Munich, Germany – 26 March 2024 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) introduces the SSO10T TSC package...
Infineon extends its XDP™ digital power protection controller family with the XDP700-002, the industry’s first wide input voltage hot-swap controller for telecom infrastructure
Munich, Germany – 25 March 2024 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) is expanding its XDP™ digital...
Infineon presents innovative semiconductor and microcontroller solutions for a greener future at embedded world 2024
Munich, Germany – 25 March 2024 – Decarbonization and digitalization are the two central challenges of our time, but they...
Cadence and NVIDIA Unveil Groundbreaking Generative AI and Accelerated Compute-Driven Innovations
Cadence Reality Digital Twin Platform integrated with NVIDIA Omniverse and Orion molecular design platform accelerated with NVIDIA BioNeMo will transform...
New Renesas MCUs with High-Resolution Analog and Over-the-Air Update Support Help Customer Systems Conserve Energy
Low-Power, Streamlined Devices Target Energy Management, Home Appliances, Building Automation and Medical Applications TOKYO, Japan--March 21, 2024--Renesas Electronics Corporation (TSE:6723),...
Microchip Technology Releases Qi® v2.0 Standards-Compliant dsPIC33-Based Reference Design
Wireless dual-pad charging design supports both Extended Power Profile and Magnetic Power Profile with a single controller March 22, 2024...
2024 State of Security Report from HID: Mobile IDs, MFA and Sustainability Emerge as Top Trends
Artificial Intelligence Appears in the Conversation for the First Time Bengaluru, India, Mar 21, 2024– HID, a worldwide leader in...
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