Rohde & Schwarz and Unigroup Spreadtrum & RDA to establish joint network operator test lab
In an MoU signed at Mobile World Congress in Barcelona, Rohde & Schwarz and Unigroup Spreadtrum & RDA agreed to...
Rohde & Schwarz becomes key test and measurement partner for Huawei’s NB-IoT eco system
Rohde & Schwarz has equipped Huawei and its subsidiary HiSilicon with complete test solutions for narrowband IoT. Since 2016, when...
Infineon Technologies and SAIC Motor establish power module joint venture SIAPM in China to power the largest market for electric vehicles in the world
Shanghai, China, and Munich, Germany – 2 March 2018 – SAIC Motor Corporation Limited and Infineon Technologies AG today announced...
Low-cost debugging and programming is now faster and more feature rich with Microchip’s MPLAB® PICkit™ 4 development tool
New tool features faster programming, wider voltage range and improved interface options for a variety of Microchip devices 1 March...
Lowest-power multi-standard, multi-band MCUs connect the building, factory and grid via Thread, Zigbee, Bluetooth® 5 and Sub-1 GHz
New TI SimpleLink™ MCU platform devices offer advanced integration for concurrent multi-standard and multi-band connectivity INDIA and DALLAS (Feb. 28,...
World’s first NB-IoT module certified for use in hazourdous environments enters initial production
Thalwil, Switzerland – March 1, 2018 – u‑blox (SIX:UBXN), a global leader in wireless and positioning modules and chips, announced...
Highly reliable and robust high CV screw terminal electrolytic capacitors from KEMET now available through TTI, Inc.
February 2018 – Now available in Europe through TTI, Inc., a world leading specialist distributor of electronic components, are ALS70...
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